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ZIF sockets take stress out of burn-in and test

A Yamaichi Electronics product story
Edited by the Electronicstalk editorial team Jun 25, 2007

Open-top 0.5mm-pitch QFN sockets for test and burn-in applications feature novel high-reliability ZIF contact mechanism.

New from Yamaichi Electronics, the NP473, NP404 and NP474 are open top 0.5mm-pitch QFN sockets for test and burn-in applications.

The new open top QFN socket series have a highly reliable fine-pitch contact system and a standard socket scaling.

For automated loading the loader change-kit needs not to be replaced for different package sizes which helps to save changeover times and costs.

The standard socket size was realised as a simple but high-reliable solution for all required test and burn-in applications.

The new QFN series can be implemented without great effort for different burn-in board IC loader settings.

Through different guide-post designs several types of ICs can be tested using only one base socket size.

The NP473 series sockets measure 25.0 x 25.0 x 20.5mm and handle devices with 12-44 pins.

The NP404 series measures 32.0 x 32.0 x 20.5mm for ICs with 16-88 pins.

And the NP474 series sockets are 45.0 x 45.0 x 20.5mm for devices with 52-124 pins.

The highly reliable contact mechanism uses a buckling beam contact concept with a coined contact tip.

Zero-insertion force minimises the IC insertion stress and a latch press mechanism ensures a stable contact force.

When the push-cover is pressed down, the IC will be easily guided into the socket.

When the push-cover is released, the latch presses onto the surface of the IC which guarantees proper IC seating and necessary contact force appears to the IC pads.

The coined tip shape contact ensures a safe and reliable contacting of the IC pads with very low contact resistance.

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A Pro-talk Publication

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