Miniature package power solutions

Edited by the Electronicstalk editorial team Sep 30, 2002

Zetex introduces the first of its MPPS miniature package power solutions in a brochure covering 28 different combinations of ultra-high-efficiency bipolar, MOSFET and Schottky devices.

Zetex introduces the first of its MPPS miniature package power solutions in a brochure covering 28 different combinations of ultra-high-efficiency bipolar, mosfet and Schottky devices.

Presented in the latest micro leaded packages (MLP), the MPPS products reviewed by the brochure achieve a three-fold reduction in temperature rise through a reduction in thermal and electrical resistance.

As a result, current handling or duty cycles are increased by at least 300%.

The brochure provides complete dimensional specifications of the two micro leaded packages used by the MPPS development programme, and a pictorial comparison with traditional surface mount alternatives is offered.

Supporting a dual die, the 3 x 2mm MLP takes less PCB area than a single die SOT23 package, whereas the 2 x 2mm MLP houses a single die and takes the same PCB area as the SOT323 package.

Both MLP types offer a reduction in component height and a significant increase in power dissipation.

The MPPS programme provides single and dual bipolar transistors in NPN and PNP polarities along with mixed polarity and transistor/Schottky combinations.

Mosfets are offered as dual and combination N and P types and mosfet/Schottky combinations.