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Product category: Discrete Power Devices
News Release from: Zetex | Subject: ZXMN2F34MA
Edited by the Electronicstalk Editorial Team on 06 March 2008

MOSFET squeezes into tiny package

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Zetex Semiconductors' ZXMN2F34MA suits space-starved switching and power management applications, such as external switches in buck/boost PoL convertors.

Zetex Semiconductors has released its first MOSFET to be packaged in the leadless 2 x 2mm DFN package With a PCB footprint 50% smaller than industry standard SOT23 packaged devices and an off-board height of 0.85mm, the ZXMN2F34MA will benefit a range of space-starved switching and power management applications, such as external switches in buck/boost PoL convertors, where PCB footprint, thermal performance and low threshold voltage are of prime importance

The MOSFET is one of a series of six new low-voltage N-channel single and dual devices to be introduced by Zetex in a variety of different surface mount packages.

In spite of its miniature size, the 20V rated ZXMN2F34MA also offers a superior thermal performance to that of the much larger SOT23, with the DFN322 leadless package, assuring a thermal resistance that is around 40% lower than comparable parts, enabling cooler running and improved power density.

At typical gate source voltages of 4.5 and 2.5V, the MOSFET's respective RDS(ON) values are 60 and 120mohm.

In addition, the low reverse recovery charge of these devices reduces switching loss and EMI problems, making them well suited for low-voltage applications in notebook computers, mobile phones and general portable electronics where low in-line power loss is essential to increase recharge intervals.

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