Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Zilog | Subject: eZ80Acclaim! eZ80F91 in BGA
Edited by the Electronicstalk Editorial
Team on 29 October 2003
BGA package shrinks microcontroller
footprint
A new 144-ball BGA package reduces the size of the eZ80Acclaim! eZ80F91 by 65%, freeing precious PCB real estate for applications in which space is a critical constraint.
A new 144-ball BGA package reduces the size of the eZ80Acclaim! eZ80F91 by 65%, freeing precious PCB real estate for applications in which space is a critical constraint BGA packaging makes it possible to radically reduce the board surface area required for silicon devices
This article was originally published on Electronicstalk on 7 Dec 2001 at 8.00am (UK)
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8bit MCU takes 15 Internet protocols onboard
ZiLog has begun shipments of its eZ80 Webserver (eZ80190), enabling easy, cost-effective, direct connections to networks and the Internet.
It provides easier handling and more effective manufacturing than traditional surface-mount technologies.
BGA packaging also provides improved electrical and thermal performance.
"We're focused on helping our customers solve their most difficult embedded design problems", said Zilog President Mike Burger.
"When they asked us to help them address space constraints in compact embedded controller designs, we answered by implementing the ball-grid array package for eZ80Acclaim!.
Now our customers can get Flash memory, enhanced communications capability, and unmatched 8bit performance in less than half the space".
The eZ80F91 144-ball BGA packaging is available now priced at $9.75 each for quantities over 10,000.
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