Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Zirkon | Subject: Lead-free processes
Edited by the Electronicstalk Editorial
Team on 03 June 2003
Industry must embrace lead-free
processes
Tony Inskip comments on progress towards the implementation of the WEEE and RoHS directives.
A recent survey carried out by the UK Environment Agency body Netregs revealed that only 18% of UK SMEs knew of the environmental legislation that applied to them In July 2006 two pieces of legislation, the WEEE and RoHS directives will come into effect
This article was originally published on Electronicstalk on 17 Oct 2002 at 8.00am (UK)
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The directives are part of Government measures to reduce the impact the UK manufacturing industry has on the environment.
The UK manufacturing and electronics industry faces a huge challenge in preparing to comply with the WEEE and RoHS legislation, but there is no reason why we shouldn't meet the challenge and come through it unscathed.
Once people are fully aware of what they need to do to comply with the new directives, it will inevitably require some investment.
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Tony Inskip, Director at Zirkon reviews the importance of the supplier/customer relationship and wonders whether such contract guidelines are really necessary in the UK and what the alternatives are.
Sufficient planning and open communications channels with suppliers and customers will allow the directives to be seamlessly absorbed into current business practice.
The main impact of the new legislation within the sector will be the restriction of lead within products and processes.
Bearing this in mind, Zirkon has held its first customer advisory session in order to discuss the implications of the move to lead-free products and to raise the customer's awareness of the implications of the RoHS legislation on the rest of their product.
We also felt that it was important to forewarn the customer that with the introduction of lead-free solder both the physical properties and the appearance of the PCB solder joints will be different to existing solder joints.
Lead-free solder currently requires the soldering process to be carried out at a higher temperature than lead based solder, which raises a number of questions.
For instance, CEMs should be looking at how parts with plastic coatings will be affected.
The temperature tolerance for these parts has to be identified, and where appropriate, alternatives sourced or processes changed.
There will also be the issue of how current equipment will cope with increased temperatures; for example, ovens and hand soldering irons may need to be replaced or adjusted.
Reflow ovens will need to be tested to measure the corrosive effect of increased gas emissions at the higher temperature on the stainless-steel linings.
In many cases, component manufacturers and suppliers are using the same part number for both leaded and lead free components, so identification of parts is likely to be a headache and is an issue we will be raising with our suppliers.
It is also possible that there could be health and safety issues relating to air quality/emissions resulting from the change in process, ie increased levels of resin used for wetting.
Air testing will have to be carried out before and after to evaluate the effects of the change to ensure a safe and clean working environment These issues are an example of the complexity of the transition to lead-free PCBs, and the multitude of things to consider to ensure there are no problems when the change to lead free is made.
Until suppliers and customers are up to speed on the issues, and we know what materials will be available to us Zirkon will continue to gather information and explore all of the options available to us.
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