Product category:
Design and Development Software
News Release from: Zuken
Edited by the Electronicstalk Editorial
Team on 14 July 2005
Project focuses microelectronic EMC
system design
Zuken has been the EDA vendor representative in a multinational research project on a microelectronic EMC system design for high density interconnect and high frequency environments.
Zuken has been working as the EDA vendor representative in a major multinational research project, MESDIE (microelectronic EMC system design for high density interconnect and high frequency environments) Zuken was selected for its specialist knowledge in EMC (electromagnetic compatibility) simulation and modelling
This article was originally published on Electronicstalk on 6 Nov 2001 at 8.00am (UK)
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The aim of the project was to research modelling for new chipsets, dedicated high density interconnect (HDI) and package modules for applications facing EMC/noise and system integration in the telecommunications, automotive, consumer and multimedia sectors.
MEDEA, the industry-initiated pan-European programme for advanced co-operative research and development in microelectronics, embarked on the multinational MESDIE project, that involved in total around 200 man years over three years.
By working in partnership with companies such as Airbus, Alcatel, Bosch, Infineon, Continental, Philips and ST-Microelectronics, the project has begun forming the basis of methods of modelling and simulation at the system design level.
Zuken played an important role in this research by advancing new technology concepts for EMC related modelling of power ground systems for various off-chip structures, at both the HDI and board level.
Although the MESDIE project came to end in May 2005, the success has already resulted in talks about extending the research and development in this area. Request free introductory details about products from Zuken ...
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