Product category:
Design and Development Software
News Release from: Zuken
Edited by the Electronicstalk Editorial
Team on 05 October 2006
Agreement unites chip, package and board
design
Zuken and Rio Design Automation are working together to create an overall optimised design environment for chips, packages and PCBs.
Zuken and Rio Design Automation are working together to create an overall optimised design environment for chips, packages and PCBs By combining Zuken's global strength in the package, semiconductor and PCB design markets with Rio's supreme advanced integration tools for package and semiconductor design, the two companies can offer an extensive optimised solution worldwide
This article was originally published on Electronicstalk on 6 Nov 2001 at 8.00am (UK)
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Zuken is trusted globally by leading companies to optimise their electrical and electronic engineering design and related manufacturing processes by offering a combination of electronic design automation and computer aided engineering solutions.
The company's clients comprise of electronics and electrical equipment manufacturers throughout the world.
Established in 2003, Santa Clara, California, based Rio develops and sells unique design tools for package and semiconductor design integration.
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During the last three years, the company's technology has been received with great interest by the industry and it has already built up a significant customer base in the USA.
In this agreement, Zuken will acquire the exclusive rights to distribute Rio's products in Japan, Korea, China, Taiwan, and other Asian countries (excluding India); support services will also be provided through Zuken's network.
Rio and Magma Design Automation have an existing OEM distribution agreement to provide IC chip designers an integrated chip and package co-optimisation flow to reduce the die size, the number of package layers, and the tedious and lengthy iterations between package and chip design.
Zuken's agreement with Rio is set to enable the creation of a complete chip/package/board solution, in addition Zuken will co-operate with Rio in the sales and support of these products in these Asian countries described.
In addition to RioMagic FC (for flip chip) which has already been released, Zuken will also resell RioMagic WB (for wirebonds), which will be available for early access this autumn and is scheduled to be officially released in February, 2007.
The company will also offer RioMagic SIP (for systems in packages), available for early access in Spring 2007.
From a technical perspective, the CR-5000 scalable and robust PCB and advanced packaging layout suite will be interfaced with Rio's products to provide a fully integrated design process.
Customers will be able to import a chip's cell layout information and pad placement details etc into RioMagic from a choice of chip layout tools from major EDA vendors including Magma, Cadence and Synopsys.
This integration will optimise floorplanning and use of design constraints and will allow the exchange of package design information to build a seamless and smooth design environment from chips to PCBs.
As a result of this partnership, the solutions offered by Zuken and Rio, will be more responsive to the needs of industries such as mobile equipment and consumer digital product manufacturers where the design complexity involved in developing products using these devices is now greater than ever as a result of being faced with rapid increases in product performance and density, and market forces to reduce time to market. Request free introductory details about products from Zuken ...
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