Laurence Marchini, Editor, writes:
We see from your search that you're looking for information on the term "Automated assembly", and we have a large number of manufacturers' news releases and technical articles here on Electronicstalk which will be of interest. Let me be your guide.
Start with the news release Wiring analyser allows rapid testing from Clare Instruments, which we summarised at the time by saying "The Horizon II is capable of 128-point testing, with the possibility of expanding up to 1024 points, with the capability of switching 1A and hipot testing up to 1500V DC and/or 1067V AC". A few weeks before, we featured the news release Alliance targets next-generation transceivers from Molex UK: "Platforms will provide the telecomms and datacomms markets with a highly reliable and low cost transceiver product line for use in both indoor and outdoor conditions".
In September 2007, we covered the news from JAE Europe concerning its MM60 PCI Express Mini Card connector system - take a look at Connector system retains Mini Card which says: "To hold the entire module securely, the connector and latch are positioned at either end of the card and operate together to enable module ejection".
Take a look also at the news release from Tyco Electronics UK, Resistors are made for automated assembly, as well as Hermetic sealing becomes universal package option from StratEdge, and Low profile inductors for line-filtering purposes from Murata Power Solutions.
MPU-controlled IBCs raise power efficiency (March 2007)
Intermediate bus convertors are capable of delivering exceptionally high levels of usable output power with a conversion efficiency of 97%
Surface mount packages run up to 18GHz (January 2007)
Power packages have low insertion loss, good return loss and excellent thermal properties
Connectors allow high-speed multipin transmission (November 2006)
Harwin has responded to demands from makers of mobile phones for a high-speed fine-line coax connector with its M480 series 0.4mm pitch micro coax connector
Power modules shrink motion control (November 2006)
Three new Motion-SPM devices come in 29 x 12mm SMD packages
IP puts PCI Express on Amba-based SoCs (October 2006)
Intellectual property provides link between the PCI Express standard and the Amba 2.0 AHB protocol
MMIC driver amplifier saves board space (October 2006)
A 5 to 14GHz gallium arsenide driver amplifier is packaged in an RoHS compliant QFN package
Recertification adds fresh focus for Palomar (October 200