An Electronicstalk guide
Start with the news release Oscillator achieves ultra-low phase noise from Z-Communications, which we summarised at the time by saying "Z-Communications has announced an RoHS-compliant VCO (voltage-controlled oscillator) in S-band for digital radio and fixed wireless applications that require ultra-low phase noise performance. ". Several months prior to that, we featured the news release QDR and DDR SRAMs for reducing power consumption from Cypress Semiconductor: "Cypress Semiconductor has announced Quad Data Rate (QDR) and Double Data Rate (DDR) SRAMs at 36-Mbit and 18-Mbit densities, for networking use in medical imaging and military signal-processing.".
In December 2010, we covered the news from Piher - take a look at Piher launches ultra-miniature rotary sensor which says: "Piher has launched the MTS360, a miniature SMD rotary sensor that is suitable for optical imaging stabilisation and precision biomedical devices, optical zoom devices, consumer electronics and more. ".
Take a look also at the news release from Tyco Electronics, Tyco cable assembly transmits multimedia content, as well as PCB connectors target board-to-board applications from Harting, and VCO for digital radio and fixed wireless systems from Z-Communications.
Spring-loaded connector from Mill-Max (November 2010)
Mill-Max's 829 series single-row, right-angle strips are suitable for applications requiring a spring-loaded connection that lies parallel to the PC board.
Endicott introduces LCP Laminates for packaging (November 2010)
Endicott Interconnect Technologies (EI) has added LCP Laminates to its range of microelectronics packaging products.
VCO suited for satellite communication systems (November 2010)
The V585ME12-LF RoHS-compliant VCO in L-Band is ideal for automated surface-mount assembly and reflow, and satellite communication and test equipment applications that require low phase noise.
FPGAs meet requirements of defence market (November 2010)
Xilinx has announced the Spartan-6Q and Virtex-6Q ranges of field programmable gate arrays (FPGAs), which are said to meet the requirements of the aerospace and defence markets.
PoE power management ICs can reduce system cost (November 2010)
Silicon Laboratories has introduced the Si348x range of power management ICs, enabling reduced system cost and improved efficiency in power over Ethernet (PoE) power sourcing equipment (PSE).
VCO provides ultra-low phase noise performance (November 2010)
Z-Communications has introduced a VCO (voltage-controlled oscillator), model CRO3150A-LF in S-band, for fixed wireless and digital radio applications that require ultra-low phase noise performance.
Texas Instruments op amps have rail-to-rail output (November 2010)
Texas Instruments has introduced three ranges of 36V single-, dual- and quad-operational amplifiers (op amp) with industrial precision.
Mosfet packaging features top-side cooling (October 2010)
In order to meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor has developed the Dual Cool packaging for Mosfets.
Lattice offers Chip Scale 132 BGA packaging
Lattice Semiconductor has released automotive temperature-qualified (AEC-Q100) low-cost Chip Scale 132 ball grid array (BGA) packaging for the non-volatile LatticeXP2 FPGA family.
Schottky shrinks into BGA packaging
The FlipKY is billed as the smallest Schottky diode in the industry.
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