An Electronicstalk guide
Start with the news release Edxact highlights debugging tools at DAC 2010 from Edxact, which we summarised at the time by saying "Post-layout verification specialist Edxact is to showcase the latest enhancements of its parasitics reduction and analysis tools at the European EDAVillage at DAC 2010.". Several months prior to that, we featured the news release Pathfinder address reliability in nanometer design from Apache Design Solutions: "Apache Design Solutions has announced Pathfinder, a full-chip electrostatic discharge (ESD) physical integrity solution to address the reliability challenges faced by nanometer designs. ".
In July 2009, we covered the news from Synopsys - take a look at In-Design Rail Analysis verifies power networks which says: "Synopsys has introduced its In-Design Rail Analysis capability to accelerate design closure. ".
Take a look also at the news release from Cadence Design Systems, Multicore design optimises ARM performance, as well as EM simulator spreads coverage from Ansoft Europe, and Op amps meet military specifications from Intersil.
Analysis software supports UMC 90nm process (March 2007)
UMC's 90nm reference design uses Apache's RedHawk-EV and Sahara-PTE.
System shows timing, signal integrity and power (September 2006)
Cadence Design Systems has further extended the capabilities of the Cadence Encounter digital IC design platform with the announcement of its Encounter Timing System.
UMC adopts thermal verification (August 2006)
UMC is to implement Gradient Design Automation products into an IC thermal verification flow, with the goal of ensuring that customer designs will operate within their temperature specifications.
Electrothermal software aids SoC reliability (July 2006)
Novel software assesses the effect of SoC temperature on leakage, timing, reliability and voltage drop.
CircuitFire is billed as the first software product to provide detailed 3D temperature analysis integrated directly into the integrated circuit design flow.
Integrated flow speeds WiMAX chip to signoff (May 2006)
Beceem Communications has achieved first-pass silicon success on a multi-million-gate low-power mobile WiMAX design in record time using Magma's RTL-to-GDSII flow.
Wave solder flux is environmentally friendly (April 2006)
Alpha EF-6100 low-solids wave solder flux is the latest addition to the EF Series of environmentally friendly fluxes
Integrated design flow enhances design services (November 2005)
eInfochips has strengthened its IC design and verification capabilities by adopting Blast Create, Blast Fusion, Blast Power, Blast Rail and Blast Noise software.
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