News Release from: Hybricon Corp
Subject: RME1021M Series
Edited by the Electronicstalk Editorial Team on 24 March 2005

Rugged enclosures keep dense boards cooler

A new line of 10U rack-mount high power enclosures features high quality ruggedised construction and a compact stackable design for vertically mounted cards.

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Hybricon Corp has released a new line of 10U rack-mount high power enclosures (the RME1021M Series) which feature high quality ruggedised construction and a compact stackable design for vertically mounted cards. The RME1021 enclosures are designed to cool extremely dense CPU and DSP boards. Dual DC impellers powered by a dedicated power supply output provide 456 litre/min per slot - sufficient cooling for 125W per slot.

The RME1021M enclosures are designed to meet MIL-STD-461 EMI radiated and conducted emissions and susceptibility standards as well as MIL-STD-810, MIL-S-901, and MIL-STD-167 environmental requirements (a commercial version, the RME821C series, is also available).

Included are front and rear cover panels with honeycomb inlet and exhaust and provisions for shielded connectors for I/O.

The enclosures are available with 21-slot CompactPCI, VME64x, VME, or VXS backplanes and up to 2400W of embedded power.

A closed loop fan speed control has programmable settings for minimum and maximum speeds and temperature break points.

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