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Product category: Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TD-SCDMA chipset solution
Edited by the Electronicstalk Editorial Team on 17 November 2004

TD-SCDMA chipset supports complex 3G
applications

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Commit hand TI have developed a flexible TD-SCDMA chipset solution easily customised for supporting complex 3G applications.

Commit, a research and development joint venture with Chinese communications equipment manufacturers and Texas Instruments are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customised for supporting complex 3G applications The TI and Commit solution incorporates TI's OMAP multimedia processors and digital signal processing (DSP) technology