Cabling tech can be implemented as part of EMDC
The structured cabling technology supplied by the Enterprise Networks business unit of TE Connectivity can now be implemented as part of IBM's Enterprise Modular Data Centre (EMDC) solution.
IBM's EMDC solution delivers a large-scale data centre that allows customers to better meet unpredictable demands by providing smaller, repeatable increments of capacity - in the same way that memory is added to a laptop.
By designing with smaller modules, clients can scale the data centre when needed to better align their business and IT needs without disruption to existing operations.
As part of a supplier agreement with TE Connectivity based on IBM client requirements, the Enterprise Modular Data Centre solution can now be deployed with TE Connectivity pre-terminated, modular cabling systems, including the IBM Fibre Transport System-T Line - a specialised offering of high-performance plug-and-play pre-terminated cabling that provides customers with scalable support of critical data-centre links.
The EMDC may also be supported by the TE Connectivity Sigma-Link high-performance bundled twisted-pair copper cabling, including shielded and UTP copper cabling systems ranging from Category 5e, through 10Gbit/s Category 6A, to TE's highest performing fully shielded category 7A system.
With global access to the comprehensive TE Connectivity line of copper cabling systems, clients can meet the structured cabling requirements of EMDC customers around the world.
Not what you're looking for? Search the site.
Tel +44 208 954 2356
Continuous identification tubing for mass transit
TE Connectivity has launched a low-fire-hazard, heat-shrinkable continuous identification tubing for industrial, rail and mass transit, aerospace and defence, as well as marine applications.
TE introduces active optical cable assemblies
TE Connectivity's second-generation Paralight QSFP+ active optical cable assemblies are suitable for applications such as high-speed interconnects within switches and transport equipment.
ChipSESD packages help reduce assembly challenges
New ChipSESD packages from TE Connectivity help reduce assembly challenges because they offer the advantages of an active silicon device combined with a traditional SMT passive body package.
Antennas for single- to penta-band applications
TE has launched a standard range of low-profile, stamped metal, flexible printed circuit (FPC) and printed circuit board (PCB) embedded antenna solutions for single- to penta-band applications.
QSFP+ optical transceivers for Ethernet apps
Tyco Electronics has launched highly compact 40Gbps QSFP+ optical transceivers, for use in switches, routers, data centres and other Ethernet applications.
Request your free weekly copy of the Electronicstalk email newsletter ...
Browse by category
- Active components (13703)
- Passive components (3644)
- Design and development (10283)
- Enclosures and panel products (4040)
- Interconnection (3718)
- Electronics manufacturing, packaging (3506)
- Industry news (2110)
- Optoelectronics (1982)
- Power supplies (3064)
- Subassemblies (5690)
- Test and measurement (5849)